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  gaas, mmic, fundamental mixer, 3 ghz to 10 ghz data sheet HMC787A rev. 0 document feedback information furnished by analog devices is believed to be accurate and reliable. however, no responsibility is assumed by analog devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. one technology way, p.o. box 9106, norwood, ma 02062-9106, u.s.a. tel: 781.329.4700 ?2016 analog devices, inc. all rights reserved. technical support www.analog.com features conversion loss: 9 db typical at 3 ghz to 9 ghz local oscillator (lo) to radio frequency (if) isolation: 43 db typical at 3 ghz to 9 ghz rf to intermediate frequency (if) isolation: 26 db typical at 3 ghz to 9 ghz input third-order intercept (ip3): 24 dbm typical at 3 ghz to 9 ghz input 1 db compression point (p1db): 17 dbm typical at 3 ghz to 9 ghz input second-order intercept (ip2): 67 dbm typical at 3 ghz to 9 ghz passive double-balanced topology wide if frequency range: dc to 4 ghz 12-terminal, ceramic, leadless chip carrier (lcc) package applications microwave radio industrial, scientific, and medical (ism) band and ultrawide band (uwb) radio test equipment and sensors military end use functional block diagram 9 8 1 37 2 5 4 6 1 2 1 1 1 0 gnd lo gnd nic nic nic gnd rf gnd gnd gnd if gnd package base 13608-001 HMC787A figure 1. general description the HMC787A is a general-purpose, double balanced mixer in a 12-terminal, rohs compliant, ceramic leadless chip carrier (lcc) package that can be used as an upconverter or down- converter from 3 ghz to 10 ghz. this mixer is fabricated in a gallium arsenide (gaas), metal semiconductor field effect transistor (mesfet) process and requires no external components or matching circuitry. the HMC787A provides excellent local oscillator (lo) to radio frequency (rf) and lo to intermediate frequency (if) isolation due to optimized balun structures and operates with a lo drive level of 17 dbm. the ceramic lcc package eliminates the need for wire bonding and is compatible with high volume, surface-mount manufacturing techniques.
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HMC787A data sheet rev. 0 | page 2 of 17 table of contents features .............................................................................................. 1 applications ....................................................................................... 1 functional block diagram .............................................................. 1 gene ral description ......................................................................... 1 revision history ............................................................................... 2 specifications ..................................................................................... 3 absolute maximum ratings ............................................................ 4 ther mal resistance ...................................................................... 4 esd caution .................................................................................. 4 pin configuration and function descriptions ............................. 5 interface schematics ..................................................................... 5 typical performance characteristics ............................................. 6 downconverter performance ......................................................6 upconverter performance ......................................................... 10 isolation and return loss performance .................................. 12 spurious and harmonics performance ................................... 14 theory of operation ...................................................................... 15 applications information .............................................................. 16 typical application circuit ....................................................... 16 evaluation pcb information .................................................... 16 outline dimensions ....................................................................... 17 ordering guide .......................................................................... 17 revision history 10 /2016 revision 0 : initial version
data sheet HMC787A rev. 0 | page 3 of 17 specifications t a = 25 c , if = 100 mhz, lo = 17 dbm , and a ll me asurements performed as downconverter , unless otherwise noted. table 1 . parameter min typ max unit frequency range rf 3 10 ghz lo 3 10 ghz if dc 4 ghz lo drive level 17 dbm performance at rf = 3 ghz to 9 ghz conversion loss 9 11 db single sideband (ssb) noise figure 9 db input third - order intercept (ip3) 15 24 dbm input 1 db compression point (p1db) 17 dbm input second - order intercept (ip2) 67 db rf to if isolation 15 26 db lo to rf isolation 48 db lo to if isolation 35 43 db performance at rf = 9 ghz to 10 ghz conversion loss 9 11 db ssb noise figure 9 db input ip3 15 24 dbm input p1db 15 dbm input ip2 66 db rf to if isolation 15 26 db lo to rf isolation 47 db lo to if isolation 25 42 db
HMC787A data sheet rev. 0 | page 4 of 17 absolute maximum ratings table 2. parameter rating rf input power 28 dbm lo input power 28 dbm if input power 28 dbm if source and sink current 12 ma continuous power dissipation, p diss (t a = 85c, derate 11.6 mw/c above 85c) 1044 mw maximum junction temperature 175c maximum peak reflow temperature (msl3) 1 260c operating temperature range ?40c to +85c storage temperature range ?55c to +125c electrostatic discharge (esd) sensitivity human body model (hbm) 1500 v (class 1c) field induced charged device model (ficdm) 1000 v (class c5) 1 see the ordering guide section. stresses at or above those listed under absolute maximum ratings may cause permanent damage to the product. this is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. operation beyond the maximum operating conditions for extended periods may affect product reliability. thermal resistance thermal performance is directly linked to printed circuit board (pcb) design and operating environment. careful attention to pcb thermal design is required. table 3. thermal resistance package type ja jc unit e-12-1 1 120 86 c/w 1 see jedec standard jesd51-2 for addi tional information on optimizing the thermal impedance (pcb with 3 3 vias). esd caution
data sheet HMC787A rev. 0 | page 5 of 17 pin configuration and fu nction descriptions 9 8 1 37 2 5 4 6 1 2 1 1 1 0 gnd lo gnd nic nic nic gnd rf gnd gnd gnd if gnd package base 13608-002 HMC787A top view (not to scale) notes 1. nic = not internally connected. 2. exposed pad. exposed pad must be connected to rf/dc ground. figure 2. pin configuration table 4. pin function descriptions pin no. mnemonic description 1, 3, 4, 6, 7, 9 gnd ground. connect the package bottom to rf/dc ground. see figure 3 for the gnd interface schematic. 2 lo local oscillator. this pin is dc-coupled and matched to 50 . see figure 4 for the lo interface schematic. 5 if intermediate frequency. this pin is dc-coupled. for a pplications not requiring operation to dc, externally block this pin using a series capacitor whose value is chosen to pass the necessary if frequency range. for operation to dc, this pin must not source or sink mo re than 12 ma of current or device nonfunction and possible device failure results. see for figure 5 the if interface schematic. 8 rf radio frequency. this pin is dc-coupled and matche d to 50 . see figure 6 for the rf interface schematic. 10 to 12 nic not internally connected. epad exposed pad. exposed pad mu st be connected to rf/dc ground. interface schematics gnd 13608-003 figure 3. gnd interface schematic lo 13608-004 figure 4. lo interface schematic i f 13608-005 figure 5. if interface schematic rf 13608-006 figure 6. rf interface schematic
HMC787A data sheet rev. 0 | page 6 of 17 typical performance characteristics downconverter performance data taken as downconverter, lo wer sideband (high-side lo), t a = 25c, and lo drive level = 17 dbm, unless otherwise noted. measurements taken with lo amplifier in line with lab bench lo source. 31 1 10 987654 conversion gain (db) rf frequency (ghz) 0 ?2 ?10 ?18 ?6 ?14 ?4 ?12 ?8 ?16 ?20 +85c +25c ?40c 13608-007 figure 7. conversion gain vs. rf frequency for various temperatures, if = 100 mhz, lo power = 17 dbm 31 1 10 987654 input ip3 (dbm) rf frequency (ghz) 50 45 25 5 35 15 40 20 30 10 0 +85c +25c ?40c 13608-008 figure 8. input third-order intercept (ip3) vs. rf frequency for various temperatures, if = 100 mhz, lo power = 17 dbm 31 1 10 987654 input ip2 (dbm) rf frequency (ghz) 100 80 40 60 20 0 90 10 50 70 30 +85c +25c ?40c 13608-009 figure 9. input second-order intercept (ip2) vs. rf frequency for various temperatures, if = 100 mhz, lo power = 17 dbm 31 1 10 987654 conversion gain (db) rf frequency (ghz) 13dbm 15dbm 17dbm 19dbm 21dbm 0 ?2 ?10 ?18 ?6 ?14 ?4 ?12 ?8 ?16 ?20 13608-010 figure 10. conversion gain vs. rf frequency for various lo powers, if = 100 mhz, temperature = 25c 31 1 10 987654 input ip3 (dbm) rf frequency (ghz) 50 45 25 5 35 15 40 20 30 10 0 13dbm 15dbm 17dbm 19dbm 21dbm 13608-011 figure 11. input third-order intercept (ip3) vs. rf frequency for various lo powers, if = 100 mhz, temperature = 25c) 31 1 10 987654 input ip2 (dbm) rf frequency (ghz) 100 80 40 60 20 0 90 10 50 70 30 13dbm 15dbm 17dbm 19dbm 21dbm 13608-012 figure 12. input second-order intercept (ip2) vs. rf frequency for various lo powers, if = 100 mhz, temperature = 25c
data sheet HMC787A rev. 0 | page 7 of 17 2.5 10.5 9.5 8.5 7.5 6.5 5.5 4.5 3.5 noise figure (db) rf frequency (ghz) 20 18 10 2 14 6 16 8 12 4 0 +85c +25c ?40c 13608-013 figure 13. single sidband noise fi gure vs. rf frequency for various temperatures, if = 100 mhz, lo power = 17 dbm 345 10 9876 conversion gain (db) rf frequency (ghz) 0 ?2 ?10 ?18 ?6 ?14 ?4 ?12 ?8 ?16 ?20 +85c +25c ?40c 13608-014 figure 14. conversion gain vs. rf frequency for various temperatures, if = 1100 mhz, lo power = 17 dbm 345 10 9876 input ip3 (dbm) 50 45 25 5 35 15 40 20 30 10 0 +85c +25c ?40c rf frequency (ghz) 13608-015 figure 15. input third-order intercept (ip3) vs. rf frequency for various temperatures, if = 1100 mhz, lo power = 17 dbm 2.5 10.5 9.5 8.5 7.5 6.5 5.5 4.5 3.5 noise figure (db) rf frequency (ghz) 20 18 10 2 14 6 16 8 12 4 0 15dbm 17dbm 19dbm 13608-016 figure 16. single sidband noise figu re vs. rf frequency for various lo powers, if = 100 mhz, temperature = 25c 345 10 9876 conversion gain (db) rf frequency (ghz) 0 ?2 ?10 ?18 ?6 ?14 ?4 ?12 ?8 ?16 ?20 13dbm 15dbm 17dbm 19dbm 21dbm 13608-017 figure 17. conversion gain vs. rf frequency for various lo powers, if = 1100 mhz, temperature = 25c 345 10 9876 input ip3 (dbm) rf frequency (ghz) 50 45 25 5 35 15 40 20 30 10 0 13dbm 15dbm 17dbm 19dbm 21dbm 13608-018 figure 18. input third-order intercept (ip3) vs. rf frequency for various lo powers, if = 1100 mhz, temperature = 25c
HMC787A data sheet rev. 0 | page 8 of 17 51 0 9 8 7 6 conversion gain (db) rf frequency (ghz) 0 ?2 ?10 ?18 ?6 ?14 ?4 ?12 ?8 ?16 ?20 +85c +25c ?40c 13608-019 figure 19. conversion gain vs. rf frequency for various temperatures, if = 3000 mhz, lo power = 17 dbm 51 0 9 8 7 6 input ip3 (dbm) rf frequency (ghz) 50 45 25 5 35 15 40 20 30 10 0 +85c +25c ?40c 13608-020 figure 20. input third-order intercept (ip3) vs. rf frequency for various temperatures, if = 3000 mhz, lo power = 17 dbm input ip2 (dbm) 100 80 40 60 20 0 90 10 50 70 30 51 0 9 8 7 6 rf frequency (ghz) +85c +25c ?40c 13608-021 figure 21. input second-order intercep t (ip2) vs. rf frequency at various temperatures, if = 3000 mhz, lo power = 17 dbm 51 0 9 8 7 6 conversion gain (db) rf frequency (ghz) 0 ?2 ?10 ?18 ?6 ?14 ?4 ?12 ?8 ?16 ?20 13dbm 15dbm 17dbm 19dbm 21dbm 13608-022 figure 22. conversion gain vs. rf frequency for various lo powers, if = 3000 mhz, temperature = 25c 51 0 9 8 7 6 input ip3 (dbm) rf frequency (ghz) 50 45 25 5 35 15 40 20 30 10 0 13dbm 15dbm 17dbm 19dbm 21dbm 13608-023 figure 23. input third-order intercept (ip3) vs. rf frequency for various lo powers, if = 3000 mhz, temperature = 25c input ip2 (dbm) 100 80 40 60 20 0 90 10 50 70 30 51 0 9 8 7 6 rf frequency (ghz) 13dbm 15dbm 17dbm 19dbm 21dbm 13608-024 figure 24. input second-order intercept (ip2) vs. rf frequency for various lo powers, if = 3000 mhz, temperature = 25c
data sheet HMC787A rev. 0 | page 9 of 17 05 4 3 2 1 conversion gain (db) if frequency (ghz) 0 ?2 ?10 ?18 ?6 ?14 ?4 ?12 ?8 ?16 ?20 +85c +25c ?40c 13608-025 figure 25. conversion gain vs. if frequency for various temperatures, lo = 9510 mhz, lo power = 17 dbm input ip3 (dbm) 50 45 25 5 35 15 40 20 30 10 0 +85c +25c ?40c if frequency (ghz) 05 4 3 2 1 13608-026 figure 26. input third-order intercept (ip3) vs. if frequency for various temperatures, lo = 9510 mhz, lo power = 17 dbm 31 1 10 8 6 49 7 5 p1db (dbm) rf frequency (ghz) 30 25 5 15 20 10 0 +85c +25c ?40c 13608-027 figure 27. input 1 db gain compression (p1db) vs. rf frequency for various temperatures, if = 100 mhz, lo = 17 dbm 05 4 3 2 1 conversion gain (db) if frequency (ghz) 0 ?2 ?4 ?6 ?8 ?10 ?12 ?14 ?16 ?18 ?20 13dbm 15dbm 17dbm 19dbm 20dbm 13608-028 figure 28. conversion gain vs. if frequency for various lo powers, lo = 9510 mhz, lo power = 17 dbm 05 4 3 2 1 input ip3 (dbm) if frequency (ghz) 50 45 40 20 30 10 35 15 25 5 0 13dbm 15dbm 17dbm 19dbm 20dbm 13608-029 figure 29. input third-order intercept (ip3) vs. if frequency for various lo powers, lo = 9510 mhz, lo power = 17 dbm
HMC787A data sheet rev. 0 | page 10 of 17 upconverter performance data taken as upconverter, lower sideband (high-side lo), t a = 25c, and lo drive level = 17 dbm, unless otherwise noted. measurements taken with lo amplifier in line with lab bench lo source. 31 1 10 987654 conversion gain (db) rf frequency (ghz) 0 ?2 ?10 ?18 ?6 ?14 ?4 ?12 ?8 ?16 ?20 +85c +25c ?40c 13608-030 figure 30. conversion gain vs. rf frequency for various temperatures, if = 100 mhz, lo power = 17 dbm 31 1 10 987654 input ip3 (dbm) rf frequency (ghz) 50 45 40 35 30 10 20 25 5 15 0 +85c +25c ?40c 13608-031 figure 31. input third-order intercept (ip3) vs. rf frequency for various temperatures, if = 100 mhz, lo power = 17 dbm 31 1 10 987654 conversion gain (db) rf frequency (ghz) 0 ?2 ?10 ?18 ?6 ?14 ?4 ?12 ?8 ?16 ?20 +85c +25c ?40c 13608-032 figure 32. conversion gain vs. rf frequency for various temperatures, if = 1100 mhz, lo power = 17 dbm 31 1 10 987654 conversion gain (db) rf frequency (ghz) 0 ?2 ?10 ?18 ?6 ?14 ?4 ?12 ?8 ?16 ?20 15dbm 17dbm 19dbm 21dbm 13608-033 figure 33. conversion gain vs. rf frequency for various lo powers, if = 100 mhz, temperature = 25c input ip3 (dbm) 50 40 20 30 10 0 45 5 25 35 15 345 11 10 9876 rf frequency (ghz) 15dbm 17dbm 19dbm 21dbm 13608-034 figure 34. input third-order intercept (ip3) vs. rf frequency for various lo powers, if = 100 mhz, temperature = 25c 31 1 10 987654 conversion gain (db) rf frequency (ghz) 0 ?2 ?10 ?18 ?6 ?14 ?4 ?12 ?8 ?16 ?20 13dbm 15dbm 17dbm 19dbm 21dbm 13608-035 figure 35. conversion gain vs. rf frequency for various lo powers, if = 1100 mhz, temperature = 25c
data sheet HMC787A rev. 0 | page 11 of 17 31 1 10 987654 input ip3 (dbm) rf frequency (ghz) 50 45 40 35 30 10 20 25 5 15 0 +85c +25c ?40c 13608-036 figure 36. input third-order intercept (ip3) vs. rf frequency for various temperatures at if = 1100 mhz, lo power = 17 dbm 51 0 9 8 7 6 conversion gain (db) rf frequency (ghz) 0 ?2 ?10 ?18 ?6 ?14 ?4 ?12 ?8 ?16 ?20 +85c +25c ?40c 13608-037 figure 37. conversion gain vs. rf frequency for various temperatures, if = 3000 mhz, lo power = 17 dbm 51 0 9 8 7 6 input ip3 (dbm) rf frequency (ghz) 50 45 40 35 15 25 5 30 10 20 0 +85c +25c ?40c 13608-038 figure 38. input third-order intercept (ip3) vs. rf frequency for various temperatures at if = 3000 mhz, lo power = 17 dbm input ip3 (dbm) 50 40 20 30 10 0 45 5 25 35 15 345 11 10 9876 rf frequency (ghz) 13dbm 15dbm 17dbm 19dbm 21dbm 13608-039 figure 39. input third-order intercept (ip3) vs. rf frequency for various lo powers at if = 1100 mhz, temperature = 25c 51 0 9 8 7 6 conversion gain (db) rf frequency (ghz) 0 ?2 ?10 ?18 ?6 ?14 ?4 ?12 ?8 ?16 ?20 13dbm 15dbm 17dbm 19dbm 21dbm 13608-040 figure 40. conversion gain vs. rf frequency for various lo powers, if = 3000 mhz, temperature = 25c input ip3 (dbm) 50 40 20 30 10 0 45 5 25 35 15 51 0 9 8 7 6 rf frequency (ghz) 13dbm 15dbm 17dbm 19dbm 21dbm 13608-041 figure 41. input third-order intercept (ip3) vs. rf frequency for various lo powers at if = 3000 mhz, temperature = 25c
HMC787A data sheet rev. 0 | page 12 of 17 isolation and return loss performance data taken as downconverter, lower side band (high-side lo), if = 100 mhz, t a = 25c, and lo drive level = 17 dbm, unless otherwise noted. measurements taken with lo amplifier in line with lab bench lo source. 31 1 10 987654 isolation (db) rf frequency (ghz) 80 70 30 50 60 10 20 40 0 +85c +25c ?40c 13608-042 lo to rf lo to if figure 42. lo to rf and lo to if isolation vs. rf frequency for various temperatures, lo power = 17 dbm 31 1 10 987654 isolation (db) rf frequency (ghz) 80 70 30 50 60 10 20 40 0 +85c +25c ?40c 13608-043 figure 43. rf to if isolation vs. rf frequency for various temperatures, lo frequency = 7000 mhz, lo power = 17 dbm 31 1 10 987654 lo return loss (db) lo frequency (ghz) 10 5 ?15 ?5 0 ?25 ?20 ?10 ?30 +85c +25c ?40c 13608-044 figure 44. lo return loss vs. lo fr equency at various temperatures, lo power = 17 dbm 31 1 10 987654 isolation (db) rf frequency (ghz) 80 70 30 50 60 10 20 40 0 19dbm 17dbm 15dbm 13608-045 lo to rf lo to if figure 45. lo to rf and lo to if isolation vs. rf frequency for various lo powers, temperature = 25c 31 1 10 987654 isolation (db) rf frequency (ghz) 80 70 30 50 60 10 20 40 0 15dbm 17dbm 19dbm 13608-046 figure 46. rf to if isolation vs. rf frequency for various lo powers, temperature = 25c, lo frequency = 7000 mhz 01 6 15 14 13 9 5 11 0 6 21 1 7 31 2 8 4 return loss (db) if frequency (ghz) 5 ?15 ?5 0 ?25 ?35 ?20 ?10 ?40 ?30 +85c +25c ?40c 13608-047 figure 47. if return loss vs. if frequency at various temperatures, lo power = 17 dbm, lo frequency = 6 ghz
data sheet HMC787A rev. 0 | page 13 of 17 01 6 15 1413 9 5 11 0 6 21 1 7 31 2 8 4 rf return loss (db) rf frequency (ghz) 5 ?15 ?5 0 ?25 ?35 ?20 ?10 ?40 ?30 +85c +25c ?40c 13608-050 figure 48. rf return loss vs. rf frequency at various temperatures, lo power = 17 dbm, lo frequency = 6 ghz
HMC787A data sheet rev. 0 | page 14 of 17 spurious and harmonics performanc e mixer spurious products are measured in dbc from the if output power level , unless otherwise not ed . spur values are (m rf) ? (n lo). lo harmonics lo = 17 dbm, and all values in dbc below input lo level measured at rf port. table 5 . harmonics of lo n lo spur at rf port lo frequency (ghz) 1 2 3 4 3 55 53 58 59 6 46 45 64 76 10 41 57 61 61 m n spurious outputs , if = 100 mhz rf = 3.1 ghz, lo = 3 ghz, rf power = ? 5 dbm, and lo power = 17 dbm . n lo 0 1 2 3 4 m rf 0 not applicable 14 38 32 5 4 1 12. 3 0 25 27 60 2 90.1 93 98 9 4 90 3 91.1 90 92 98 94 4 89.1 88 91 94 98 rf = 6.1 ghz, lo = 6 ghz, rf power = ?5 dbm, and lo power = 17 dbm. n lo 0 1 2 3 4 m rf 0 not a pplicable 12 26 42 42 1 16.3 0 36 35 50 2 89.1 91 97 90 88 3 86.2 88 88 95 87 4 83.1 87 89 90 96 rf = 10 .1 ghz, lo = 10 ghz, rf power = ? 5 dbm, and lo power = 17 dbm . n lo 0 1 2 3 4 m r f 0 not applicable 4 3 9 36 43 1 19.9 0 87 83 79 2 84.3 84 97 87 83 3 78.4 82 87 97 8 7 4 72.4 78 83 89 95 m n spurious outputs , if = 3000 mhz rf = 3.1 ghz, lo = 6.1 ghz, rf power = ?5 dbm, and lo power = 17 dbm . n lo 0 1 2 3 4 m r f 0 not a pplicable 13 28 44 44 1 13.6 0 47 4 5 64 2 90.7 99 89 89 86 3 91 93 94 87 87 4 90.2 89 99 9 2 90 rf = 6.1 ghz, lo = 3.1 ghz, rf power = ?5 dbm, and lo power = 17 dbm . n lo 0 1 2 3 4 m r f 0 not a pplicable 13 39 28 50 1 16 0 24 18 90 2 89 88 89 92 97 3 8 6 86 89 87 89 4 82 86 85 87 89 rf = 10.1 ghz, lo = 7.1 ghz, rf power = ?5 dbm, and lo power = 17 dbm. n lo 0 1 2 3 4 m rf 0 not a pplicable 11 28 41 54 1 17.7 0 30 35 52 2 82.9 86 84 94 86 3 75 81 86 87 92 4 68 76 79 83 87
data sheet HMC787A rev. 0 | page 15 of 17 theory of operation the HMC787A is a general - purpose, double balanced mixer in a 12 - terminal, rohs compliant, ceramic leadless chip carrier (lcc) package that can be used as an upconverter or down - converter from 3 ghz to 10 ghz. this mixer is fabricated in a gallium arsenide (gaas), metal semiconductor field effect transistor (mesfet) process and requires no external components or matching circuitry. the HMC787A provides excellent local oscillator (lo) to radio frequency (rf) and lo to intermediate frequency (if) isolation due to optimized balun structures and operates with a lo drive level of 17 dbm. the ce ramic lcc package eliminates the need for wire bonding and is compatible with high volume, surface - mount manufacturing techniques.
HMC787A data sheet rev. 0 | page 16 of 17 applications information typical application circuit figure 49 shows the typical application circuit for the HMC787A . the lo and rf pins are internally ac-coupled. when if operation is not required until dc, it is recommended to use an ac-coupled capacitor at the if port. when if operation to dc is required, do not exceed the if source and sink currents specified in the absolute maximum ratings section. 9 8 1 37 2 5 4 6 1 2 1 1 1 0 rf lo if 13608-048 figure 49. typical applications circuit evaluation pcb information the circuit board used in the application must use rf circuit design techniques. signal lines must have 50 impedance, and the package ground leads and exposed pad must be connected directly to the ground plane similarly to that shown in figure 50. use a sufficient number of via holes to connect the top and bottom ground planes. the evaluation circuit board shown in figure 50 is available from analog devices, inc., upon request. 13608-049 figure 50. evaluation pcb top layer table 6. bill of materials for the ev1HMC787Alc3b evaluation pcb quantity reference designator part number description 1 117611-1 pcb, evaluation board 2 j1 to j2 104935 2.92 mm connectors, sri 1 j3 105192 sma connector, johnson 1 u1 HMC787Alcb device under test (dut)
data sheet HMC787A rev. 0 | page 17 of 17 outline dimensions 05-05-2016-a p kg-004837 0.50 bsc bottom view top view side view seating plane 0.92 max 1 4 6 7 9 10 12 3 for proper connection of the exposed pad, refer to the pin configuration and function descriptions section of this data sheet. 0.36 0.30 0.24 p i n 1 ( 0 . 3 2 0 . 3 2 ) exposed pad pin 1 indicator 3.13 3.00 sq 2.87 2.10 bsc 1.00 ref 1.60 1.50 sq 1.40 figure 51. 12-terminal cerami c leadless chip carrier [lcc] (e-12-1) dimensions shown in millimeters ordering guide model 1 temperature range package body material lead finish msl rating 2 package description package option package marking 3 HMC787Alc3b ?40c to +85c alumina ceramic gold over nickel msl3 12-terminal ceramic leadless chip carrier [lcc] e-12-1 h787a xxxx HMC787Alc3btr ?40c to +85c alumina ceramic gold over nickel msl3 12-terminal ceramic leadless chip carrier [lcc] e-12-1 h787a xxxx HMC787Alc3btr-r5 ?40c to +85c alumina ceramic gold over nickel msl3 12-terminal ceramic leadless chip carrier [lcc] e-12-1 h787a xxxx ev1HMC787Alc3b evaluation pcb assembly 1 the HMC787Alc3b, the HMC787A lc3btr, and the hmc 787alc3btr-r5 are rohs compliant parts. 2 see the absolute maximum ratings section. 3 the HMC787Alc3b, the HMC787Alc 3btr, and the HMC787Alc 3btr-r5 have a four digit lot number. ?2016 analog devices, inc. all rights reserved. trademarks and registered trademarks are the prop erty of their respective owners. d13608-0-10/16(0)


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